Specifications - Mfr Part Number: MX-2 (4G)
- Application: CPU, GPU and other applications between power semiconductor components and heat sinks.
- Features:
- High Thermal Conductivity
- Low Thermal Resistance
- Non-Electrical Conductive
- Non-Capacitive
- Non-Curing
- Non-Corrosive
- No Bleeding
- Odorless
- Density: 3.69 g/ cm3
- Viscosity: 2850 poise
- Net Weight: 4 g
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